Patent Assignment
Reel/Frame 022409/0231
Assignment of Assignor's Interest
Recorded: 2009-03-17
Pages: 4
Assignors
YOO, WON HEE
Executed: 2009-02-11
CHANG, BYEUNG GYU
Executed: 2009-02-11
LEE, TAEK JUNG
Executed: 2009-02-11
KIM, YONG SUK
Executed: 2009-02-11
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Ceramic Multi-Layer Circuit Substrate and Manufacturing Method Thereof