Ceramic multi-layer circuit substrate and manufacturing method thereof
Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
1. A method of manufacturing a ceramic multi-layer circuit substrate, comprising steps of:
forming a plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes and a thickness of 1.5 mm or less are layered one on top of another;
firing the ceramic blocks;
aligning the fired ceramic blocks with each other;
preparing one or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks and having a thickness from about 40 μm to about 100 μm;
disposing each of the bonding green sheets between a pair of the ceramic blocks opposing each other;
bonding the ceramic blocks with the bonding green sheets into a resultant structure; and
firing the resultant structure.
2. The method of claim 1 , wherein firing the ceramic blocks comprises:
forming holding layers on both sides of each of the ceramic blocks, the holding layers containing inorganic powder that is not fired at a firing temperature of the ceramic blocks;
separately firing the ceramic blocks each with the holding layers on both sides thereof; and
removing the holding layers from the fired ceramic blocks.
3. The method of claim 1 , wherein the step of preparing one or more bonding green sheets comprises:
producing a ceramic green sheet from a ceramic composition;
forming one or more via-holes in the ceramic green sheet by punching the ceramic green sheet in positions corresponding to the via-electrodes of the ceramic blocks; and
forming the bonding electrodes by filling the via-holes with a metal material.
4. The method of claim 3 , wherein the metal material comprises silver paste.
5. The method of claim 1 , wherein each of the bonding electrodes has a thickness from about 45 μm to about 130 μm.
6. A ceramic multi-layer circuit substrate comprising:
a plurality of ceramic blocks each having a thickness of 1.5 mm or less, in each of which one or more ceramic green sheets having via-electrodes are layered one on top of another; and
one or more bonding green sheets, each of which is disposed between a pair of the ceramic blocks opposing each other and has bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks and has a thickness from about 40 μm to about 100 μm.