Patent Assignment
Reel/Frame 022419/0890
Assignment of Assignor's Interest
Recorded: 2009-03-19
Pages: 4
Assignors
FUJII, TOMOYUKI
Executed: 2009-03-03
NAKAMURA, TAICHI
Executed: 2009-03-09
TAKEBAYASHI, HIROSHI
Executed: 2009-03-03
Assignee
NGK INSULATORS, LTD.
2-56, SUDA-CHO, MIZUHO-KU, NAGOYA-SHI, AICHI-KEN, JAPAN
Covered Property
(1)
Bonding Structure and Semiconductor Device Manufacturing Apparatus