Assignment of Assignor's Interest

Recorded: 2009-03-24 Pages: 2

Assignor

F&K DELVOTEC BONDTECHNIK GMBH

Executed: 2008-11-03

Assignee

SIEMENS AKTIENGESELLSCHAFT

WITTELSBACHERPLATZ 2, MUNICH, DE-80333, GERMANY

Covered Properties (3)

Die Presentation System for Die Bonder

Patent: 5,203,659 →

Application: 07/896,495 →

Mechanism for Exchanging Chip-Carrier Plates for Use in a Hybrid Chip-Bonding Machine

Patent: 7,156,602 →

Application: 10/081,028 →

Publication: US 2003/0086775

Chip-Transferring Station for a Bonding Machine

Patent: 6,786,320 →

Application: 10/358,422 →

Publication: US 2004/0099509

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.