Patent Assignment
Reel/Frame 023044/0828
Assignment of Assignor's Interest
Recorded: 2009-08-05
Pages: 4
Assignor
SIEMENS AKTIENGESELLSCHAFT
Executed: 2009-07-31
Assignee
SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG
RUPERT-MAYER-STRASSE 44, MUENCHEN, 81379, GERMANY
Covered Properties
(13)
Die Presentation System for Die Bonder
Patent:
5,203,659 →
Application:
07/896,495 →
Process for Determining the Position and Coplanarity of the Leads of Components Equipping
Patent:
5,502,890 →
Application:
08/307,749 →
Process for Determining the Position and/or Checking the Separation and/or Checking the Coplanarity of the Leads of Components
Patent:
5,687,475 →
Application:
08/625,128 →
Device for Checking the Position the Coplanarity and the Separation of Terminals of Components
Patent:
6,064,483 →
Application:
09/093,345 →
Method and Apparatus for Optically Checking an Electrical Component at an Equipping Head
Patent:
6,081,338 →
Application:
09/115,050 →
"Method and Device for Detecting the Position of Terminals and/or Edge of Components"
Patent:
6,480,223 →
Application:
09/176,361 →
Method and Apparatus for Calibrating a Travel Path and/or an Angular Position of a Holding Device in a Means for Manufacturing Electrical Assemblies as Well as a Calibration Substrate
Patent:
6,055,049 →
Application:
09/179,830 →
Device for Feeding Electrical Components into Insertion Machines
Patent:
6,273,666 →
Application:
09/341,081 →
Assembly Device
Patent:
6,574,857 →
Application:
09/807,185 →
Device for Fitting a Substrate with a Flip Chip
Patent:
7,028,392 →
Application:
09/914,906 →
Mechanism for Exchanging Chip-Carrier Plates for Use in a Hybrid Chip-Bonding Machine
Method and device for determining the pick-up position of electrical components in a component in a components placement device
Application:
10/220,535 →
Publication:
US 2003/0159279
Chip-Transferring Station for a Bonding Machine
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 3, 2005
From: MICROMONT ENTWICKLUNGS- UND HANDELS GMBH
To: SIEMENS AKTIEGESELLSCHAFT
Reel/Frame 016976/0336 →
Corrective Coversheet to Correct the Receiving Party's Name on the Assignment Previously Recorded on Reel 016976, Frame 0336.
Jan 12, 2006
From: MICROMONT ENTWICKLUNGS - UND HANDELS GMBH
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 017176/0577 →
Assignment of Assignor's Interest
Mar 24, 2009
From: F&K DELVOTEC BONDTECHNIK GMBH
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 022427/0983 →
Change of Name
Mar 25, 2011
From: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG
To: ASM ASSEMBLY SYSTEMS GMBH & CO. KG
Reel/Frame 026026/0550 →