Patent Assignment
Reel/Frame 022429/0932
Assignment of Assignor's Interest
Recorded: 2009-03-20
Pages: 8
Assignors
YOON, MINSEUNG
Executed: 2009-03-06
KIM, NAMSEOG
Executed: 2009-03-06
KIM, PYOUNGWAN
Executed: 2009-03-06
MA, KEUMHEE
Executed: 2009-03-06
JO, CHAJEA
Executed: 2009-03-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Through-Silicon via Structures Including Conductive Protective Layers