Patent Assignment
Reel/Frame 022452/0118
Assignment of Assignor's Interest
Recorded: 2009-03-25
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2009-01-09
JENG, SHIN-PUU
Executed: 2009-01-09
TU, HUNG-JUNG
Executed: 2009-01-09
CHIOU, WEN-CHIH
Executed: 2009-01-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Robust TSV structure