Patent Assignment
Reel/Frame 022458/0671
Assignment of Assignor's Interest
Recorded: 2009-03-27
Pages: 2
Assignors
NISHIURA, TAKAYUKI
Executed: 2009-02-12
MEZAKI, YOSHIO
Executed: 2009-02-13
YABUHARA, YOSHIKI
Executed: 2009-02-16
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33 KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI, 541-0041, JAPAN
Covered Property
(1)
Method of Packaging Compound Semiconductor Substrates