Assignment of Assignor's Interest

Recorded: 2009-03-30 Pages: 2

Assignor

FURUYA, AKIRA

Executed: 2009-03-23

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Plating Method, Semiconductor Device Manufacturing Method and Plate Processing System

Application: 12/414,215 →

Publication: US 2009/0242409

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.