Patent Assignment
Reel/Frame 022480/0130
Assignment of Assignor's Interest
Recorded: 2009-03-19
Pages: 3
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having Wiring Formed on Wiring Board and Electric Conductor Formed in Wiring Board and Conductor Chip Formed Over Wiring
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.