Patent Assignment
Reel/Frame 022488/0047
Assignment of Assignor's Interest
Recorded: 2009-04-02
Pages: 3
Assignor
SOCKETSTRATE, INC.
Executed: 2008-02-28
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Manufacturing Method for Wiring Circuit Substrate
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 2, 2009
From: NORTH CORPORATION
To: SOCKETSTRATE, INC.
Reel/Frame 022486/0875 →
Merger
Jan 30, 2012
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 027622/0384 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →