Patent Assignment
Reel/Frame 022488/0498
Assignment of Assignor's Interest
Recorded: 2009-04-03
Pages: 3
Assignors
BABA, SUSUMU
Executed: 2009-03-17
MASUDA, MASACHIKA
Executed: 2009-03-17
SUZUKI, HIROMICHI
Executed: 2009-03-17
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO, 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Wiring Device for Semiconductor Device, Composite Wiring Device for Semiconductor Device, and Resin-Sealed Semiconductor Device