Patent Assignment
Reel/Frame 022497/0164
Assignment of Assignor's Interest
Recorded: 2009-04-02
Pages: 2
Assignors
CHAN, MAN WAI
Executed: 2009-03-24
AU, YUK CHEUNG
Executed: 2009-03-24
WONG, KWOK WAI
Executed: 2009-03-24
CHONG, CHI MING
Executed: 2009-03-24
Assignee
ASM ASSEMBLY AUTOMATION LTD
20/F., WATSON CENTRE, 16-22 KUNG YIP ST., KWAI CHUNG, HONG KONG
Covered Property
(1)
Device for Thin Die Detachment and Pick-Up