Patent Assignment
Reel/Frame 022515/0198
Assignment of Assignor's Interest
Recorded: 2009-04-07
Pages: 7
Assignors
KIM, MYUNG-SUN
Executed: 2009-03-03
RHEE, HWA-SUNG
Executed: 2009-03-03
LEE, HO
Executed: 2009-03-03
YI, JI-HYE
Executed: 2009-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Different Thickness Silicon-Germanium Layers on Semiconductor Integrated Circuit Devices and Semiconductor Integrated Circuit Devices Fabricated Thereby