Patent Assignment
Reel/Frame 022527/0274
Assignment of Assignor's Interest
Recorded: 2009-04-09
Pages: 4
Assignors
KANAOKA, MASARU
Executed: 2009-03-12
OGITA, TAIRA
Executed: 2009-03-12
MURAI, TOORU
Executed: 2009-03-12
TADANO, SHIGERU
Executed: 2009-03-12
TODOH, MASAHIRO
Executed: 2009-03-12
Assignees
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
8, KITA 8-JYO NISHI 5-CHOME, KITA-KU, SAPPORO-SHI, HOKKAIDO, 060-0808, JAPAN
Covered Property
(1)
Laser Processing Apparatus, Osseointegration Method, Implant Material, and Implant-Material Fabrication Method