Patent Assignment
Reel/Frame 022563/0326
Assignment of Assignor's Interest
Recorded: 2009-04-17
Pages: 3
Assignors
LEE, SEUNG SEOUP
Executed: 2009-03-05
YIM, SOON GYU
Executed: 2009-03-05
HAN, JONG WOO
Executed: 2009-03-06
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Method of Attaching Die Using Self-Assembling Monolayer and Package Substrate Including Die Attached Thereto Using Self-Assembling Monolayer