Patent Assignment
Reel/Frame 022563/0372
Assignment of Assignor's Interest
Recorded: 2009-04-17
Pages: 3
Assignors
KANG, JOON SEOK
Executed: 2009-03-04
YI, SUNG
Executed: 2009-03-03
KWEON, YOUNG DO
Executed: 2009-03-03
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Wafer Level Package for Heat Dissipation and Method of Manufacturing the Same