Patent Assignment
Reel/Frame 022567/0345
Assignment of Assignor's Interest
Recorded: 2009-04-20
Pages: 3
Assignor
KUROSAWA, YOSHIAKI
Executed: 2009-03-30
Assignee
SUMCO TECHXIV CORPORATION
1324-2 MASURAGAHARA-MACHI, OMURA-SHI, NAGASAKI-KEN, 856-8555, JAPAN
Covered Property
(1)
Device and Method for Manufacturing a Semiconductor Wafer