IP Library Assignment 022567/0573
Patent Assignment
Reel/Frame 022567/0573

Assignment of Assignor's Interest

Recorded: 2009-04-20 Pages: 18
Assignor
IRVINE SENSORS CORPORATION
Executed: 2009-03-16
Assignee
APROLASE DEVELOPMENT CO., LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Property (1)
Wire Bond Method for Angularly Disposed Conductive Pads and a Device Made from the Method
Patent: 7,772,045 →
Application: 11/977,447 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 25, 2009
From: BINDRUP, RANDY WAYNE
To: IRVINE SENSORS CORPORATION
Reel/Frame 022316/0934 →
Assignment of Assignor's Interest Jun 8, 2009
From: BINDRUP, RANDY WAYNE
To: IRVINE SENSORS CORPORATION
Reel/Frame 022794/0459 →
Merger Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →