Patent Assignment
Reel/Frame 037406/0200
Merger
Recorded: 2015-12-30
Pages: 12
Assignor
APROLASE DEVELOPMENT CO., LLC
Executed: 2015-08-26
Assignee
NYTELL SOFTWARE LLC
2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(63)
Multiplexer Circuitry for High Density Analog Signals
Patent:
4,490,626 →
Application:
06/403,004 →
Multiplexer Circuitry for High Density Analog Signals
Patent:
33,331 →
Application:
07/336,017 →
Sensing and Selecting Observed Events for Signal Processing
Patent:
5,635,705 →
Application:
08/526,415 →
Stackable Layers Containing Encapsulated Ic Chips
Patent:
5,953,588 →
Application:
08/777,747 →
Stacking Layers Containing Enclosed Ic Chips
Patent:
6,195,268 →
Application:
09/031,435 →
Ic Stack Utilizing Secondary Leadframes
Patent:
6,028,352 →
Application:
09/095,415 →
Ic Stack Utilizing Bga Contacts
Patent:
6,014,316 →
Application:
09/095,416 →
Multi- Element Micro Gyro
Patent:
5,955,668 →
Application:
09/166,458 →
Multi-Element Micro Gyro
Patent:
6,089,089 →
Application:
09/301,847 →
Stack of Equal Layer Neo-Chips Containing Encapsulated Ic Chips of Different Sizes
Patent:
6,072,234 →
Application:
09/316,740 →
Method of Prducing a High Quality, High Resolution Image from a Sequence of Low Quality, Low Resolution Images That Are Undersampled and Subject to Jitter
Patent:
6,650,704 →
Application:
09/427,384 →
Multi-Axis Micro Gyro Structure
Patent:
6,578,420 →
Application:
09/604,782 →
Method of Canceling Quadrature Error in an Angular Rate Sensor
Mems Sensor with Single Central Anchor and Motion-Limiting Connection Geometry
Method of Designing a Flexure System for Tuning the Modal Response of a Decoupled Micromachined Gyroscope and a Gyroscoped Designed According to the Method
Retro-Reflector Warm Stop for Uncooled Thermal Imaging Cameras and Method of Using the Same
Method of Making Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlaying Interconnect Layers
Multilayer Modules with Flexible Substrates
Stack of Multilayer Modules with Heat-Focussing Metal Layer
Stacking of Multilayer Modules
High Speed Multi-Stage Switching Network Formed from Stacked Switching Layers
Highly Configuarable Capacitive Transducer Interface Circuit
Patent:
6,731,121 →
Application:
10/110,889 →
Method and Apparatus for Connecting Vertically Stacked Integrated Circuit Chips
Stackable Microcircuit Layer Formed from a Plastic Encapsulated Microcircuit and Method of Making the Same
Video event capture, storage and processing method and apparatus
Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlying Interconnect Layers and a Method of Making the Same
Method for Effectively Embedding Various Integrated Circuits Within Field Programmable Gate Arrays
Field Programmable Gate Array with a Variably Wide Word Width Memory
Stackable Layers Containing Ball Grid Array Packages
Multilayer Modules with Flexible Substrates
Neo-Wafer Device and Method
Three-Dimensional Module Comprised of Layers Containing Ic Chips with Overlying Interconnect Layers
High Speed Switching Module Comprised of Stacked Layers Incorporating T-Connect Structures
Vertically Stacked Pre-Packaged Integrated Circuit Chips
Field Programmable Gate Array Incorporating Dedicated Memory Stacks
Bga-Scale Stacks Comprised of Layers Containing Integrated Circuit Die and a Method for Making the Same
Stackable Semiconductor Chip Layer Comprising Prefabricated Trench Interconnect Vias
Method for Precision Integrated Circuit Die Singulation Using Differential Etch Rates
Stackable Layer Containing Ball Grid Array Package
Anti-Tamper Module
Method for Making a Neo-Layer Comprising Embedded Discrete Components
Low Power Electronic Circuit Incorporating Real Time Clock
Global Positioning Using Planetary Constants
Stackable Tier Structure Comprising Prefabricated High Density Feedthrough
Mems Cooling Device
Tier Structure with Tier Frame Having a Feedthrough Structure
Absolute Pressure Sensor
Patent:
7,380,459 →
Application:
11/654,292 →
Three-Dimensional Ladar Module with Alignment Reference Insert Circuitry
Patent:
7,436,494 →
Application:
11/706,724 →
Ball Grid Array Stack
Patent:
7,990,727 →
Application:
11/731,154 →
Large Format Thermoelectric Infrared Detector and Method of Fabrication
Field Programmable Gate Array Utilizing Dedicated Memory Stacks in a Vertical Layer Format
Wire Bond Method for Angularly Disposed Conductive Pads and a Device Made from the Method
Patent:
7,772,045 →
Application:
11/977,447 →
Chip Scale Vacuum Pump
Patent:
8,485,793 →
Application:
12/283,746 →
Three-Dimensional Ladar Module with Alignment Reference Insert Circuitry Comprising High Density Interconnect Structure
Forced Vibration Piezo Generator and Piezo Actuator
Stackable Layer Containing Ball Grid Array Package
Patent:
43,536 →
Application:
12/500,434 →
Three-Dimensional Ladar Module with Alignment Reference Insert Circuitry
Patent:
43,722 →
Application:
12/607,253 →
Field Programmable Gate Array Utilizing Dedicated Memory Stacks in a Vertical Layer Format
Stacked Ball Grid Array Package Module Utilizing One or More Interposer Layers
Method for Precision Integrated Circuit Die Singulation Using Differential Etch Rates
Patent:
43,877 →
Application:
12/712,810 →
Stackable Layer Containing Ball Grid Array Package
Vertically Stacked Pre-Packaged Integrated Circuit Chips
Stackable Layer Containing Ball Grid Array Package
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 2, 2020
From: NYTELL SOFTWARE LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0173 →
Assignment of Assignor's Interest
May 11, 2020
From: NYTELL SOFTWARE LLC
To: INTELLECTUAL VENTURES ASSETS 134 LLC
Reel/Frame 052623/0482 →
Assignment of Assignor's Interest
Oct 22, 2020
From: NAKANISHI, TATSURO; TSURUMI, RISA; OHASHI, TAKASHI; ISHIHARA, YOSHIYUKI
To: TOCHIGI PREFECTURE
Reel/Frame 054142/0121 →
Assignment of Assignor's Interest
Feb 17, 2021
From: INTELLECTUAL VENTURES ASSETS 134 LLC
To: PINEAPPLE34, LLC
Reel/Frame 055280/0878 →
Assignment of Assignor's Interest
Feb 12, 2023
From: NYTELL SOFTWARE LLC
To: INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 062708/0535 →
Security Interest
Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Assignment of Assignor's Interest
Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →