High speed switching module comprised of stacked layers incorporating t-connect structures
View Patent ↗A compact multi-stage switching network ( 100 ), and a router ( 510 ) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports ( 110 ) to selected ones of a second plurality of output ports ( 190 ) comprising: a first stack ( 140 ) of IC switching layers ( 113 ) that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit ( 142 ); a second stack ( 160 ) of IC switching layers ( 113 ) that are stacked in physical contact with one another, each IC switching layer ( 113 ) containing at least one switching element circuit ( 162 ); and interconnecting circuitry ( 150 ) that connects the first stack ( 140 ) of IC layers to the second stack ( 160 ) of IC layers to form the compact multi-stage switching network. The stacks ( 140, 160 ) are preferably mated to one another in a transverse fashion in order to achieve a natural full-mesh connection. Also contemplated are the use of superconducting IC switching circuits ( 142 ) and a suitable superconducting cooling housing ( 730 ), as permitted by the compact nature of the multi-stage switching network ( 100 ), in order to operate at high speed and low power.
1. A compact multi-stage switching network configured to simultaneously route a plurality of data packets from a first plurality of input ports to selected ones of a second plurality of output ports comprising:
a first stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another; each IC switching layer containing at least one switching element circuit wherein at least one of said switching element circuits in at least one of said IC switching layers of said first stack of IC layers is in electrical connection with at least one other of said switching element circuits in at least one other of said IC switching layers of said first stack of IC layers by means of a metalized T-connect;
a second stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit; wherein at least one of said switching element circuits in at least one of said IC switching layers of said second stack of IC layers is in electrical connection with at least one other of said switching element circuits in at least one other of said IC switching layers of said second stack of IC layers by means of a metalized T-connect structure; and
means for interconnecting the first stack of IC layers to the second stack of IC layers to form the compact multi-stage switching network.
2. A compact multi-stage switching network configured to simultaneously route a plurality of data packets from a first plurality of input ports to selected ones of a second plurality of output ports comprising:
a first stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
a second stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
wherein at least one of said switching element circuits in at least one of said IC switching layers of said first stack of IC layers is in electrical connection with at least one of said switching element circuits in at least one other of said IC switching layers of said second stack of IC layers by means of a metalized T-connect structure; and
means for interconnecting said first stack of IC layers to said second stack of IC layers to form said compact multi-stage switching network.
3. A compact multi-stage switching network configured to simultaneously route a plurality of data packets from a first plurality of input ports to selected ones of a second plurality of output ports comprising:
a first stack of layers including a plurality of superconducting switching layers that are stacked in physical contact with one another, each superconducting switching layer containing at least one superconducting switching element circuit wherein at least one of said superconducting switching element circuits in at least one of said superconducting switching layers of said first stack of layers is in electrical connection with at least one other of said superconducting switching element circuits in at least one other of said superconducting switching layers of said first stack of layers by means of a metalized T-connect;
a second stack of layers including a plurality of superconducting switching layers that are stacked in physical contact with one another, each superconducting switching layer containing at least one superconducting switching element circuit wherein at least one of said superconducting switching element circuits in at least one of said superconducting switching layers of said second stack of layers is in electrical connection with at least one other of said superconducting switching element circuits in at least one other of said superconducting switching layers of said second stack of layers by means of a metalized T-connect;
means for interconnecting said first stack of layers to the second stack of layers to form a compact assembly; and
means for cooling the compact assembly to a superconducting temperature.