Patent Assignment
Reel/Frame 026632/0405
Release of Security Interest
Recorded: 2011-07-22
Received: 2011-07-22
Pages: 51
Assignee
IRVINE SENSORS CORPORATION
C/O W. ERIC BOYD, 3001 REDHILL AVE. BLDG. 4/108, COSTA MESA, CA, 92626, UNITED STATES
Covered Properties
(44)
Anastomosis Device Approximating Structure Configurations
Application:
12/797,296 →
High density interconnect assembly comprising stacked electronic module
Application:
11/499,403 →
Low Power Electronic Circuit Incorporating Real Time Clock
Application:
11/415,891 →
Method for Making a Neo-Layer Comprising Embedded Discrete Components
Application:
11/354,370 →
Neo-wafer device comprised of multiple singulated integrated circuit die
Application:
11/302,480 →
Cornerbond assembly comprising three-dimensional electronic modules
Application:
11/301,645 →
Anti-Tamper Module
Application:
11/248,659 →
Stackable Layer Containing Ball Grid Array Package
Application:
11/229,351 →
Method for Precision Integrated Circuit Die Singulation Using Differential Etch Rates
Application:
11/197,828 →
Bga-Scale Stacks Comprised of Layers Containing Integrated Circuit Die and a Method for Making the Same
Application:
11/062,507 →
Imaging Device with Multiple Fields of View Incorporating Memory-Based Temperature Compensation of an Uncooled Focal Plane Array
Application:
11/048,634 →
Field Programmable Gate Array Incorporating Dedicated Memory Stacks
Application:
11/037,490 →
High Speed Switching Module Comprised of Stacked Layers Incorporating T-Connect Structures
Application:
10/960,712 →
Three-Dimensional Module Comprised of Layers Containing Ic Chips with Overlying Interconnect Layers
Application:
10/951,990 →
Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits
Application:
10/805,849 →
Three-Dimensional Imaging Processing Module Incorporating Stacked Layers Containing Microelectronic Circuits
Application:
10/806,037 →
Method for Electrical Interconnection of Angularly Disposed Conductive Patterns
Application:
10/726,888 →
Neo-Wafer Device and Method
Application:
10/703,177 →
Method for Creating Neo-Wafers from Singulated Integrated Circuit Die and a Device Made According to the Method
Application:
10/701,783 →
Stacked microelectronic module with vertical interconnect vias
Application:
10/663,371 →
Cryopump Piston Position Tracking
Application:
10/615,641 →
Multilayer Modules with Flexible Substrates
Application:
10/431,914 →
Stackable Layers Containing Ball Grid Array Packages
Application:
10/360,244 →
Field Programmable Gate Array with a Variably Wide Word Width Memory
Application:
10/347,038 →
Method for Effectively Embedding Various Integrated Circuits Within Field Programmable Gate Arrays
Application:
10/346,363 →
Method of Fabricating Known Good Dies from Packaged Integrated Circuits
Application:
10/338,974 →
High-Density Stacked Printed Circuit Board Assembly
Application:
10/339,023 →
Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlying Interconnect Layers and a Method of Making the Same
Application:
10/302,680 →
Method and Apparatus for Temperature Compensation of an Uncooled Focal Plane Array
Application:
10/281,393 →
Highly Configuarable Capacitive Transducer Interface Circuit
Application:
10/110,889 →
Wearable biomonitor with flexible thinned integrated circuit
Application:
10/197,006 →
Video event capture, storage and processing method and apparatus
Application:
10/178,390 →
Stackable Microcircuit Layer Formed from a Plastic Encapsulated Microcircuit and Method of Making the Same
Application:
10/142,557 →
Method and Apparatus for Connecting Vertically Stacked Integrated Circuit Chips
Application:
10/128,728 →
Method of Making Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlaying Interconnect Layers
Application:
09/938,686 →
High Speed Multi-Stage Switching Network Formed from Stacked Switching Layers
Application:
09/973,857 →
Stacking of Multilayer Modules
Application:
09/949,512 →
Stack of Multilayer Modules with Heat-Focussing Metal Layer
Application:
09/949,024 →
Multilayer Modules with Flexible Substrates
Application:
09/948,950 →
Retro-Reflector Warm Stop for Uncooled Thermal Imaging Cameras and Method of Using the Same
Application:
09/921,525 →
Method of Designing a Flexure System for Tuning the Modal Response of a Decoupled Micromachined Gyroscope and a Gyroscoped Designed According to the Method
Application:
09/893,329 →
Mems Sensor with Single Central Anchor and Motion-Limiting Connection Geometry
Application:
09/884,880 →
Method and Apparatus for Temperature Compensation of an Uncooled Focal Plane Array
Application:
09/853,819 →
Method of Canceling Quadrature Error in an Angular Rate Sensor
Application:
09/812,147 →