Process of manufacturing multilayer modules
View Patent ↗A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second edges, respectively. Each active layer includes a flexible, polymer substrate and at least one electronic element formed within the substrate. Electrically-conductive traces provide electrical connections from the first and second edges to the electronic elements. An adhesive is applied to at least one of a top surface of the first active layer and a bottom surface of the second active layer and the top surface of the first active layer is adhered to the bottom surface of the second active layer. The first edge and the second edge are aligned with each other thereby forming a side of the multilayer module. Electrically-conductive lines are applied along the side of the multilayer module to provide electrical connections to the traces.
1. A method of providing electrical connections to a plurality of electronic elements within a multilayer module, the method comprising:
providing a first active layer having a first edge and comprising a flexible, polymer substrate, at least one electronic element formed within the flexible, polymer substrate, and a plurality of electrically-conductive traces which provide electrical connections from the first edge to the electronic element of the first active layer;
providing a second active layer having a second edge and comprising a flexible, polymer substrate, at least one electronic element formed within the flexible, polymer substrate, and a plurality of electrically-conductive traces which provide electrical connections from the second edge to the electronic element of the second active layer;
applying an adhesive to at least one of a top surface of the first active layer and a bottom surface of the second active layer and adhering the top surface of the first active layer to the bottom surface of the second active layer, wherein the first edge and the second edge are aligned with each other thereby forming a side of the multilayer module; and
applying a plurality of electrically-conductive lines along the side of the multilayer module, the electrically-conductive lines providing electrical connections to the electrically-conductive traces of the first and second active layers.
2. The method according to claim 1 , wherein the thickness of the combination of the first and second active layers is less than or equal to approximately 0.005″.
3. The method according to claim 1 , wherein the step of applying the plurality of electrically-conductive lines comprises:
depositing metallic material on the side of the multilayer module; and
removing portions of the metallic material to form the plurality of electrically-conductive lines on the side of the multilayer module.
4. The method according to claim 3 , wherein the deposited metallic material includes a plurality of layers.
5. The method according to claim 4 , wherein the metallic material of at least two of the plurality of layers differs.