Method for making a neo-layer comprising embedded discrete components
View Patent ↗A stackable neo-layer comprising one or more embedded discrete electrical components is provided. A plurality of conductive traces, some of which terminate at a peripheral edge of the layer, are formed on sacrificial substrate in a series of process steps and discrete electrical components such as thick film components or wire bonded components are attached thereto. An under-bump metal process step is disclosed and provides for solder attachment at desired contact pad locations. The layer is encapsulated in a potting material and thinned to provide a thin, stackable layer. When assembled into a stack of layers, the electrically conductive traces terminating at the edge of the layer can be electrically connected by means of electroplating using a T-connect.
1. A method for making a stackable layer comprising the steps of:
providing a sacrificial substrate having a first surface and a second surface,
defining a first dielectric layer on said first surface,
defining a plurality of electrically conductive traces on said first dielectric layer,
defining a second dielectric layer upon said first dielectric layer whereby said electrically conductive traces are encapsulated therein,
removing predetermined portions of said second dielectric layer to expose portions of said electrically conductive traces to define a plurality of contact pads,
electrically connecting at least one discrete electrical component to at least one of said contact pads,
encapsulating said second dielectric layer and said at least one discrete electrical component in a potting material,
removing said sacrificial layer to define a component surface and a test surface, and,
defining one or more vias in said test surface to define a test contact pad.
2. The method of claim 1 where said substrate is an aluminum material.
3. The method of claim 1 where said substrate is removed by etching.
4. The method of claim 1 where said dielectric is a polyimide material.
5. The method of claim 1 further comprising the step of testing said stackable layer.
6. The method of claim 1 wherein said at least one discrete electrical component is electrically connected by means of a wire bond.
7. The method of claim 1 further comprised of removing a predetermined portion said potting material.
8. A method for making a stackable layer comprising the steps of:
providing a sacrificial substrate having a first surface and a second surface,
defining a first dielectric layer on said first surface,
defining a plurality of electrically conductive traces on said first dielectric layer,
defining a second dielectric layer upon said first dielectric layer whereby said traces are encapsulated therein,
removing predetermined portions of said second dielectric layer to define a plurality of contact pads,
providing an under-bump metal on at least one of said contact pads to define an under-bump metal contact pad
electrically connecting at least one discrete electrical component to at least one of said under-bump metal contact pads by means of a solder connection,
encapsulating said at least one discrete electrical component in a potting material,
removing said sacrificial layer to define a component surface and a test surface, and,
defining one or more vias in said test surface to define a test contact pad.
9. The method of claim 8 wherein said at least one discrete electrical component is a thick film surface mount component.
10. The method of claim 8 wherein said at least one discrete electrical component is a thin film surface mount component.
11. The method of claim 8 where said substrate is an aluminum material.
12. The method of claim 8 where said substrate is removed by etching.
13. The method of claim 8 where said dielectric is a polyimide material.
14. The method of claim 8 further comprising the step of testing said stackable layer.
15. The method of claim 8 wherein said at least one discrete electrical component is electrically connected by means of a wire bond.
16. The method of claim 8 further comprised of removing a predetermined portion said potting material.