IP Library › Assignment 022586/0408
Patent Assignment
Reel/Frame 022586/0408

Assignment of Assignor's Interest

Recorded: 2009-04-23 Pages: 3
Assignor
MATHEW, RANJAN J.
Executed: 2007-10-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Direct Device Attachment on Dual-Mode Wirebond Die
Patent: 7,880,310 →
Application: 11/863,346 →
Publication: US 2009/0085201