Patent Assignment
Reel/Frame 022587/0755
Assignment of Assignor's Interest
Recorded: 2009-04-23
Pages: 5
Assignors
KIM, TAE-GUI
Executed: 2009-03-25
SHIN, YOUNG-HWAN
Executed: 2009-03-25
LEE, JAE-SOO
Executed: 2009-03-25
LEE, TAE-GON
Executed: 2009-03-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Manufacturing Method Thereof