IP Library › Assignment 022595/0599
Patent Assignment
Reel/Frame 022595/0599

Assignment of Assignor's Interest

Recorded: 2009-04-24 Pages: 3
Assignors
YEO, ALFRED
Executed: 2009-04-23
CHAN, KAI CHONG
Executed: 2009-04-23
Assignee
CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
60 WOODLANDS INDUSTRIAL PARK D, STREET 2, SINGAPORE 738406, SINGAPORE
Covered Property (1)
Integrated Circuit Packaging System and Method of Manufacture Thereof
Patent: 7,892,963 →
Application: 12/429,916 →
Publication: US 2010/0270670
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 16, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 024087/0589 →
Change of Name Mar 16, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 024088/0280 →
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →