Patent Assignment
Reel/Frame 022602/0791
Assignment of Assignor's Interest
Recorded: 2009-04-28
Pages: 8
Assignors
TIMANS, PAUL J.
Executed: 2007-06-08
O'CARROLL, CONOR PATRICK
Executed: 2007-06-12
CARDEMA, RUDY
Executed: 2007-06-08
FIDELMAN, IGOR
Executed: 2007-06-11
TAY, SING-PIN
Executed: 2007-06-08
HU, YAO ZHI
Executed: 2007-06-08
DEVINE, DANIEL J.
Executed: 2007-06-12
Assignee
MATTSON TECHNOLOGY, INC.
47131 BAYSIDE PARKWAY, FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Method and System for Thermally Processing a Plurality of Wafer-Shaped Objects
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 27, 2018
From: MATTSON TECHNOLOGY, INC.
To: EAST WEST BANK
Reel/Frame 046956/0348 →
Assignment of Assignor's Interest
Sep 30, 2019
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
Reel/Frame 050582/0796 →
Release of Security Interest
Apr 15, 2021
From: EAST WEST BANK
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055950/0452 →