IP Library › Assignment 022613/0232
Patent Assignment
Reel/Frame 022613/0232

Assignment of Assignor's Interest

Recorded: 2009-04-29 Pages: 2
Assignor
TDK INNOVETA INC.
Executed: 2008-09-30
Assignee
DENSEI LAMBDA K.K.
1-11-15 HIGASHI-GOTANDA, SHINAGAWA-KU, TOKYO, 141-0022, JAPAN
Covered Property (1)
Surface Mount Power Module Dual Footprint
Patent: 8,319,114 →
Application: 12/061,453 →
Publication: US 2009/0251873
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 30, 2008
From: CHENG, SUN-WEN CYRUS; LEMOND, PAULETTE; WILDRICK, CARL MILTON
To: TDK INNOVETA INC.
Reel/Frame 021317/0840 →
Change of Name Feb 7, 2013
From: DENSEI-LAMBDA K.K.
To: TDK-LAMBDA CORPORATION
Reel/Frame 029777/0411 →
Corrective Assignment to Correct the State of Incorporation for Tdk Innoveta Inc. from Texas to Delaware Previously Recorded on Reel 022613 Frame 0232. Assignor(S) Hereby Confirms the State in Which Tdk Innoveta Inc. Was Incorporated Was Delaware, Not Texas.. Feb 20, 2013
From: TDK INNOVETA INC.
To: DENSEI-LAMBDA K.K.
Reel/Frame 029839/0717 →