Surface mount power module dual footprint
View Patent ↗A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.
1. A dual footprint mounting package for a surface mount technology (SMT) electrical component, the package comprising:
in a SMT power converter module device, at least one edge pad in electrical continuity with a SMT pad, wherein the SMT pad forms an electrical connection to the SMT power converter module device when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT power converter module device and the PWB when soldered to a surface pad on the PWB; and
at least one isolated edge pad not in electrical continuity with the SMT pad, wherein the isolated edge pad forms a mechanical connection to the PWB when soldered to a pad on the PWB.
2. The package of claim 1 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package.
3. The package of claim 1 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package.
4. A dual footprint mounting package for a surface mount technology (SMT) electrical component, the package comprising:
in a SMT power converter module device, at least one edge pad in electrical continuity with a SMT pad, wherein the SMT pad forms an electrical connection to the SMT power converter module device when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT power converter module device and the PWB when soldered to a surface pad on the PWB; and
a solder barrier device to prevent the flow of solder between the edge pad and its respective SMT pad.
5. The package of claim 4 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package.
6. The package of claim 4 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package.
7. A dual footprint mounting package for a surface mount technology (SMT) electrical component, the component utilizing at least one SMT pad, the package comprising:
at least one edge pad in electrical continuity with the SMT pad, wherein the SMT pad forms an electrical connection to the SMT electrical component when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT electrical component and the PWB when soldered to a surface pad on the PWB; and
at least one isolated edge pad not in electrical continuity with the SMT pad, wherein the isolated edge pad forms a mechanical connection to the PWB when soldered to a pad on the PWB.
8. The package of claim 7 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package.
9. The package of claim 7 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package.
10. A dual footprint mounting package for a surface mount technology (SMT) electrical component, the component utilizing at least one SMT pad, the package comprising:
at least one edge pad in electrical continuity with the SMT pad, wherein the SMT pad forms an electrical connection to the SMT electrical component when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT electrical component and the PWB when soldered to a surface pad on the PWB; and
a solder barrier device to prevent the flow of solder between the edge pad and its respective SMT pad.
11. The package of claim 10 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package.
12. The package of claim 10 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package.