IP Library › Assignment 022623/0290
Patent Assignment
Reel/Frame 022623/0290

Assignment of Assignor's Interest

Recorded: 2009-04-30 Pages: 4
Assignors
HUGHES, JOHN A.
Executed: 2009-04-28
LOVE, THOMAS E.
Executed: 2009-04-28
LEMOINE, EUGENE
Executed: 2009-04-28
LEE, DAVID H.
Executed: 2009-04-28
EBEL, CHRISTOPHER
Executed: 2009-04-28
Assignee
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
PO BOX 868, NASHUA, NEW HAMPSHIRE, 03061-0868
Covered Property (1)
System and Method for Multi-Chip Module Die Extraction and Replacement
Patent: 8,067,829 →
Application: 12/432,672 →
Publication: US 2010/0276794