Patent Assignment
Reel/Frame 022638/0717
Assignment of Assignor's Interest
Recorded: 2009-05-05
Pages: 3
Assignee
TOPPAN FORMS CO., LTD.
1-7-3, HIGASHI-SHIMBASHI, MINATO-KU, TOKYO, 105-8311, JAPAN
Covered Property
(1)
Window Base Material, Card with Embedded Module, and Manufacturing Method of Card with Embedded Module