Patent Assignment
Reel/Frame 022644/0088
Assignment of Assignor's Interest
Recorded: 2009-05-05
Pages: 2
Assignors
SU, KENG-LI
Executed: 2009-03-04
LIN, CHIH SHENG
Executed: 2009-03-03
HSIAO, CHIH-WEN
Executed: 2009-03-03
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING, ROAD, CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Monitoring Method for Through-Silicon Vias of Three-Dimensional Intergrated Circuit (3D Ic) and Apparatus Using the Same