IP Library Assignment 022664/0880
Patent Assignment
Reel/Frame 022664/0880

Assignment of Assignor's Interest

Recorded: 2009-05-11 Pages: 4
Assignors
HIRANO, NAOHIKO
Executed: 2009-02-11
SAKAMOTO, YOSHITSUGU
Executed: 2009-02-16
OKUMURA, TOMOMI
Executed: 2009-02-17
TSURUTA, KAICHI
Executed: 2009-02-24
UESHIMA, MINORU
Executed: 2009-03-02
ISHII, TAKASHI
Executed: 2009-02-24
Assignees
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-SHI, AICHI, 448-8661, JAPAN
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property (1)
Solder Preform and Electronic Component
Patent: 7,800,230 →
Application: 12/226,764 →
Publication: US 2009/0236725