Patent Assignment
Reel/Frame 022675/0058
Assignment of Assignor's Interest
Recorded: 2009-05-13
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package and Printed Circuit Board Having Through Interconnections