Patent Assignment
Reel/Frame 022687/0373
Assignment of Assignor's Interest
Recorded: 2009-05-14
Pages: 2
Assignor
KANAZAWA, MASAKI
Executed: 2008-11-19
Assignee
TOKYO SEIMITSU CO., LTD.
7-1, SHIMORENJAKU 9-CHOME, MITAKA-SHI, TOKYO, JAPAN
Covered Property
(1)
Wafer Grinding Machine and Wafer Grinding Method