Patent Assignment
Reel/Frame 022687/0426
Assignment of Assignor's Interest
Recorded: 2009-05-14
Pages: 2
Assignor
BECKER, SCOTT T.
Executed: 2009-05-14
Assignee
TELA INNOVATIONS, INC.
655 CAMPBELL TECHNOLOGY PKWY, SUITE 150, CAMPBELL, CALIFORNIA, 95008
Covered Property
(1)
Oversized Contacts and Vias in Semiconductor Chip Defined by Linearly Constrained Topology
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2021
From: TELA INNOVATIONS, INC.
To: RPX CORPORATION
Reel/Frame 056602/0001 →
Patent Security Agreement
Apr 21, 2023
From: RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 063424/0569 →
Release of Lien on Patents
Aug 5, 2024
From: BARINGS FINANCE LLC
To: RPX CORPORATION
Reel/Frame 068328/0278 →
Patent Security Agreement
Aug 6, 2024
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 068328/0674 →