IP Library Assignment 022688/0253
Patent Assignment
Reel/Frame 022688/0253

Assignment of Assignor's Interest

Recorded: 2009-05-15 Pages: 6
Assignors
SEARLS, DAMION
Executed: 2008-09-10
ROTH, WESTON C.
Executed: 2008-09-11
RAMIREZ, MARGARET D.
Executed: 2008-09-11
JACKSON, JAMES D.
Executed: 2008-09-12
THOMAS, RAINER E.
Executed: 2008-09-12
GEALER, CHARLES A.
Executed: 2008-09-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Mainboard assembly including a package overlying a die directly attached to the mainboard
Application: 12/231,965 →
Publication: US 2010/0061056
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2023
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP.
Reel/Frame 062437/0329 →