Patent Assignment
Reel/Frame 022691/0256
Assignment of Assignor's Interest
Recorded: 2009-05-07
Pages: 3
Assignor
SATO, YUKO
Executed: 2009-04-28
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device and Molding Die
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.