Patent Assignment
Reel/Frame 022704/0462
Assignment of Assignor's Interest
Recorded: 2009-05-19
Pages: 3
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Having an Antenna on the Molding Compound Thereof