Patent Assignment
Reel/Frame 022715/0712
Assignment of Assignor's Interest
Recorded: 2009-05-21
Pages: 4
Assignors
TAIN, RA-MIN
Executed: 2009-03-10
CHAO, YU-LIN
Executed: 2009-03-10
YANG, SHU-JUNG
Executed: 2009-03-10
FANG, RONG-CHANG
Executed: 2009-03-10
LI, WEI
Executed: 2009-03-10
CHENG, CHIH-YUAN
Executed: 2009-03-10
HSIEH, MING-CHE
Executed: 2009-03-10
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Chip Package Structure and Manufacturing Method Thereof