Patent Assignment
Reel/Frame 022718/0180
Assignment of Assignor's Interest
Recorded: 2009-05-21
Pages: 5
Assignors
CHAPARALA, SATISH CHANDRA
Executed: 2009-04-27
HU, MARTIN HAI
Executed: 2009-04-15
HUGHES, LAWRENCE CHARLES, JR.
Executed: 2009-05-19
ZAH, CHUNG-EN
Executed: 2009-04-28
Assignee
CORNING INCORPORATED
INTELLECTUAL PROPERTY DEPARTMENT, SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Fracture Resistant Metallization Pattern for Semiconductor Lasers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.