Patent Assignment
Reel/Frame 022728/0349
Assignment of Assignor's Interest
Recorded: 2009-05-22
Pages: 3
Assignor
KOZASA, KAZUAKI
Executed: 2009-05-11
Assignee
SUMCO TECHXIV CORPORATION
1324-2, MASURAGAHARA-MACHI, OMURA-SHI, NAGASAKI 856-8555, JAPAN
Covered Property
(1)
Slurry Supplying Apparatus and Method of Polishing Semiconductor Wafer Utilizing Same