IP Library Assignment 022736/0637
Patent Assignment
Reel/Frame 022736/0637

Assignment of Assignor's Interest

Recorded: 2009-05-27 Pages: 2
Assignors
NAKAISO, NAOHARU
Executed: 2009-04-09
MAEDA, KIYOHIKO
Executed: 2009-04-09
YAMADA, MASAYUKI
Executed: 2009-04-09
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1 SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 7,883,581 →
Application: 12/421,117 →
Publication: US 2009/0258504
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →