Patent Assignment
Reel/Frame 022738/0506
Assignment of Assignor's Interest
Recorded: 2009-05-26
Pages: 3
Assignor
MIYAJIMA, TAKESHI
Executed: 2009-02-12
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same