Patent Assignment
Reel/Frame 022744/0344
Assignment of Assignor's Interest
Recorded: 2009-05-28
Pages: 7
Assignors
FAROOQ, MUKTA G.
Executed: 2009-04-06
HANNON, ROBERT
Executed: 2009-04-08
IYER, SUBRAMANIAN S.
Executed: 2009-04-06
KINSER, EMILY R.
Executed: 2009-04-08
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Three Dimensional Integrated Circuit Integration Using Dielectric Bonding First and Through via Formation Last