Patent Assignment
Reel/Frame 022747/0714
Assignment of Assignor's Interest
Recorded: 2009-05-28
Pages: 6
Assignors
MUTHUKUMAR, SRIRAM
Executed: 2007-07-09
MANCERA, RAUL
Executed: 2007-07-09
TOMITA, YOSHIHIRO
Executed: 2007-07-09
HWANG, CHI-WON
Executed: 2007-07-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Multi-Chip Packaging Using an Interposer with Through-Vias
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.