IP Library Assignment 022766/0500
Patent Assignment
Reel/Frame 022766/0500

Assignment of Assignor's Interest

Recorded: 2009-06-02 Pages: 4
Assignors
MORITA, SHINYA
Executed: 2009-01-26
SATO, AKIHIRO
Executed: 2009-01-27
TANAKA, AKINORI
Executed: 2009-01-26
NAKADA, SHIGEO
Executed: 2009-01-26
NAKADA, TAKAYUKI
Executed: 2009-01-26
SAIDO, SHUHEI
Executed: 2009-01-27
MATSUDA, TOMOYUKI
Executed: 2009-02-03
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1 SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 8,851,886 →
Application: 12/363,059 →
Publication: US 2009/0197409
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 26, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047620/0001 →