Patent Assignment
Reel/Frame 047620/0001
Change of Name
Recorded: 2018-11-26
Pages: 33
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-06-01
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4 KANDA-KAJICHO, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(57)
Manufacturing Method of Semiconductor Device and Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Ceiling Insulating Part
Substrate Processing Apparatus
Information Managing Method, Information Managing Apparatus and Substrate Processing System
Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus
Substrate Processing Apparatus, Semiconductor Device Manufacturing Method and Temperature Controlling Method
Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus and Display Method for Substrate Processing Apparatus
Substrate Processing System
Substrate Processing Apparatus and Method of Displaying Abnormal State of Substrate Processing Apparatus
Semiconductor Device Manufacturing Method and Substrate Processing Apparatus
Substrate Processing Apparatus and Display Method of Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device
Heating Device Having a Meander-Shaped Heating Element with an Insulating Body Accomodating the Same, and the Substrate Processing Apparatus Including the Same
Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Substrate Processing Apparatus , Method of Manufacturing Semiconductor Device, and Method of Manufacturing Substrate
Method of Manufacturing Semiconductor Device and Substrate Processing System
Heating Device, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
Method of Manufacturing a Semiconductor Device
Method of Manufacturing Semiconductor Device, Cleaning Method, and Substrate Processing Apparatus
Substrate Processing System
Substrate Processing System, Group Managing Apparatus, and Method of Analyzing Abnormal State
Method of Manufacturing Semiconductor Device, Method of Processing Substrate and Substrate Processing Apparatus
Manufacturing Method of Semiconductor Device, and Semiconductor Device
Semiconductor Device Manufacturing Method and Substrate Processing Apparatus
Substrate Processing Apparatus and Method for Manufacturing Semiconductor Device
Test Terminal and Setup System Including the Same of Substrate Processing Apparatus
Information Managing Method, Information Searching Method and Data Displaying Method
Display Method for Substrate Processing Apparatus
Method of Manufacturing a Semiconductor Device
Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Processing Error of Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device Using Meander-Shaped Heating Element
Method of Manufacturing a Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing a Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing a Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Method and Apparatus of Manufacturing a Semiconductor Device by Forming a Film on a Substrate
Method of Manufacturing Semiconductor Device for Forming Film Including at Least Two Different Elements
Method of Manufacturing Semiconductor Device for Forming Film Including at Least Two Different Elements
Method of Manufacturing Semiconductor Device for Forming Film Including at Least Two Different Elements
Substrate Processing Apparatus Capable of Forming Films Including at Least Two Different Elements
Substrate Processing Apparatus for Forming Film Including at Least Two Different Elements
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 9, 2009
From: MURATA, HITOSHI; KOSUGI, TETSUYA; SUGIURA, SHINOBU
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 022226/0036 →
Assignment of Assignor's Interest
Feb 13, 2009
From: NODA, TAKAAKI; MIYAMOTO, MASAMI; YAMAMOTO, RYUJI
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 022256/0300 →
Assignment of Assignor's Interest
May 18, 2009
From: NOMURA, MAKOTO; OZAKI, YUKIO; NUNOZAWA, REIZO; TAKAHATA, SATORU
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 022696/0791 →
Assignment of Assignor's Interest
Jun 2, 2009
From: MORITA, SHINYA; SATO, AKIHIRO; TANAKA, AKINORI; NAKADA, SHIGEO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 022766/0500 →
Assignment of Assignor's Interest
Jun 25, 2009
From: ASAI, KAZUHIDE; IWAKURA, HIROYUKI; KOSHIMAKI, TOSHIRO; YASHIKI, KAYOKO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 022875/0729 →
Assignment of Assignor's Interest
Jul 28, 2009
From: YAMAZAKI, HIROHISA; OKADA, SATOSHI; KATO, TSUTOMU
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023014/0293 →
Assignment of Assignor's Interest
Sep 23, 2009
From: MORITA, SHINYA; NAKADA, TAKAYUKI; MATSUDA, TOMOYUKI; SAKASHITA, KEISUKE
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023270/0344 →
Assignment of Assignor's Interest
Sep 25, 2009
From: NAKADA, TAKAYUKI; SADA, KOICHI; MATSUDA, TOMOYUKI
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023285/0039 →
Assignment of Assignor's Interest
Oct 2, 2009
From: NAKADA, TAKAYUKI; MATSUDA, TOMOYUKI; MORITA, SHINYA
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023318/0083 →
Assignment of Assignor's Interest
Oct 30, 2009
From: YAMADA, TOMOYUKI; OISHI, MAMORU; KITAYAMA, KANAKO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023448/0053 →
Assignment of Assignor's Interest
Dec 3, 2009
From: SUGISHITA, MASASHI; UENO, MASAAKI; IIDA, TSUKASA; NISHIURA, SUSUMU
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023598/0761 →
Assignment of Assignor's Interest
Feb 22, 2010
From: TAKAHATA, SATORU; OZAKI, YUKIO; NUNOZAWA, REIZO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023967/0510 →
Assignment of Assignor's Interest
Mar 1, 2010
From: SAKATA, MASAKAZU; TAKAHASHI, AKIRA; YANAI, HIDEHIRO; TAKEBAYASHI, MOTONARI
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 024007/0592 →
Assignment of Assignor's Interest
Mar 1, 2010
From: KAWASAKI, JUNICHI
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 024004/0333 →
Assignment of Assignor's Interest
Apr 20, 2010
From: KATAOKA, NORIHIKO; MORI, SHINICHIRO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 024260/0293 →
Assignment of Assignor's Interest
Apr 27, 2010
From: MORITA, OSAMU
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 024295/0102 →
Assignment of Assignor's Interest
Apr 27, 2010
From: MIZUNO, NORIKAZU
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 024295/0390 →