Assignment of Assignor's Interest

Recorded: 2009-02-09 Pages: 2

Assignors

MURATA, HITOSHI

Executed: 2009-01-22

KOSUGI, TETSUYA

Executed: 2009-01-22

SUGIURA, SHINOBU

Executed: 2009-01-22

Assignee

HITACHI KOKUSAI ELECTRIC, INC.

14-1 SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1018980, JAPAN

Covered Property (1)

Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Ceiling Insulating Part

Patent: 8,535,444 →

Application: 12/367,751 →

Publication: US 2009/0209113

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.